2018 Intel Cup Embedded System Design Contest (ESDC) Webinar

 

                                   Webinar time:       20:00~22:00,       April 27th (Friday), 2018   (Beijing Time)

                                   Register deadline:   24:00 April 26th (Thursday), 2018 (Beijing Time)

                                    Registration web:   http://market.itcgb.com/contents/intel/esdc_global/edm.html

 

The 2018 Intel Cup Embedded System Design Contest opened on March 21st. The theme of the contest is Artificial Intelligence and IoT.

 

The UP Squared Grove IoT Development Kit based on the latest generation Atom chip is the main mandatory platform for the contest, and specially designed Cyclone 5 FPGA is optional. In addition, participants can also choose to use Intel VPU-based Movidius neural compute stick to design creative works. Relevant software platforms are free for participants. The training content of all hardware and software platforms and tools can be found on the contest training website(https://software.intel.com/en-us/esdc/2018).

 

2018 ESDC webinar includes: Up Squared Grove, Cyclone 5 FPGA, Movidius Neural Compute Stick, Android on Intel Architecture, Intel Software Tools.

 

The webinar includes training part and Q&A. The training video will last for 60 min. After that, Intel engineers will support the online Q&A part. Please get familiar with the contest platforms before the webinar starts so that Intel engineers can better answer your questions. Considering the time difference, the webinar time will be a little tough for some of participants. Thanks for your cooperation and understanding.

 

If you still have questions after webinar, you can raise it on contest forum which can be found at https://software.intel.com/en-us/esdc/2018.

 

Webinar time:

      20:00~22:00,       April 27th (Friday), 2018   (Beijing Time)

 

The time for other location (just for reference, pls. make sure attend the webinar at 20:00~22:00 in April 27 (Beijing Time)):

Location

Time

Date

Shanghai

20:00-22:00

April 27th(Fri)

Hongkong

20:00-22:00

April 27th(Fri)

Singapore

20:00-22:00

April 27th(Fri)

India

17:30-19:30

April 27th(Fri)

USA

5:00-7:00

April 27th(Fri)

Brazil

9:00-11:00

April 27th(Fri)

 

 

Pls. make sure to register before the Webinar, or you cannot attend the webinar. For registration, pls. go to the web: http://market.itcgb.com/contents/intel/esdc_global/edm.html , After registration, you will receive an email to tell you how to attend the webinar. Pls. register before 24:00 April 26 (Thursday) (Beijing Time)

 

Registration time : Before the time below (just for reference).

 Location

Time

Date

Shanghai

0:00

April 27th(Fri)

Hongkong

0:00

April 27th(Fri)

Singapore

0:00

April 27th(Fri)

India

21:30

April 26th(Thu)

USA

9:00

April 26th(Thu)

Brazil

13:00

April 26th(Thu)

 

 

Copyright: 2018 Intel Cup Undergraduate Electronic Design Contest – Embedded System Design Invitational Contest E-mail: nuedc@sjtu.edu.cn

Shanghai ICP prepared to pay 2010990 Technical support: Information Technology Co., Ltd. Shanghai Yi Chao